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IEC 61760-4:2015/AMD1:2018 ED1

Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices IEC 61760-4:2015/AMD1:2018 ED1

Publication date:   Mar 13, 2018

General information

99.60   Withdrawal effective   May 28, 2026

IEC

TC 91

International Standard

31.190   Electronic component assemblies

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Revised

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Life cycle

PREVIOUSLY

WITHDRAWN
IEC 61760-4:2015 ED1

NOW

WITHDRAWN
IEC 61760-4:2015/AMD1:2018 ED1
99.60 Withdrawal effective
May 28, 2026

REVISED BY

PUBLISHED
IEC 61760-4:2026 ED2




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