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Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
60.60 Standard published
Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
60.60 Standard published
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
60.60 Standard published
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
60.60 Standard published
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
60.60 Standard published
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
60.60 Standard published
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
60.60 Standard published
Product package labels for electronic components using bar code and two- dimensional symbologies
60.60 Standard published
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
60.60 Standard published
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
60.60 Standard published
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
60.60 Standard published
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
60.60 Standard published
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
60.60 Standard published
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
60.60 Standard published
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
60.60 Standard published
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
60.60 Standard published
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
60.60 Standard published
