EN 62137-4:2014/AC:2015

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices EN 62137-4:2014/AC:2015

General information

60.60   Standard published   Feb 13, 2015

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.190   Electronic component assemblies

Life cycle

PREVIOUSLY

PUBLISHED
EN 62137-4:2014

NOW

PUBLISHED
EN 62137-4:2014/AC:2015
60.60 Standard published
Feb 13, 2015




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