EN 62137-1-2:2007

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test EN 62137-1-2:2007

Publication date:   Nov 30, 2007

General information

60.60 Standard published   Aug 31, 2007

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.190   Electronic component assemblies

Buying

Published

Language in which you want to receive the document.

Scope

The test method described in IEC 62137-1-2:2007 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.

Life cycle

NOW

PUBLISHED
EN 62137-1-2:2007
60.60 Standard published
Aug 31, 2007