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EN 62137-1-1:2007

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test EN 62137-1-1:2007

Publication date:   Nov 30, 2007

General information

60.60   Standard published   Aug 31, 2007

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.190   Electronic component assemblies

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Scope

The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.

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PUBLISHED
EN 62137-1-1:2007
60.60 Standard published
Aug 31, 2007




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