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prEN IEC 61191-10-2:2026

prEN IEC 61191-10-2:2026

Name: prEN IEC 61191-10-2:2026
Brand: CENELEC
SKU: prEN IEC 61191-10-2:2026
Price: 15.42 EUR
Availability: InStock
Rating: 4 (66 reviews)

Circuit board assemblies - Part 10-2 : Guideline for Establishing Bonding Parameters in Laser-Assisted Bonding between Semiconductor Chip and Substrate

Publication date: Aug 21, 2026

General information

Current stage: 40.20 DIS ballot initiated: 12 weeks Aug 21, 2026

Originator: CENELEC

Owner: CLC/SR 91 Electronics assembly technology

Type: European Norm

ICS: 31.180 Printed circuits and boards | 31.190 Electronic component assemblies

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Status: Draft

PDF - €15.42

Languages: English

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Life cycle

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IN_DEVELOPMENT
prEN IEC 61191-10-2:2026
40.20 DIS ballot initiated: 12 weeks
Aug 21, 2026