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prEN IEC 61191-10-2:2026

Circuit board assemblies - Part 10-2 : Guideline for Establishing Bonding Parameters in Laser-Assisted Bonding between Semiconductor Chip and Substrate prEN IEC 61191-10-2:2026

Publication date:   Aug 21, 2026

General information

40.20   DIS ballot initiated: 12 weeks   Aug 21, 2026

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

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prEN IEC 61191-10-2:2026
40.20 DIS ballot initiated: 12 weeks
Aug 21, 2026




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