FprEN IEC 61189-2-809:2024

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies – Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA

Publication date:   Aug 12, 2022

General information

50.60 Close of voting. Proof returned by secretariat   Nov 1, 2024

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards

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Scope

IEC 61189-2-809:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical analyser (TMA).

This method is applicable to materials that are solid of the entire range of temperature used and retain sufficient hardness and rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur.

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FprEN IEC 61189-2-809:2024
50.60 Close of voting. Proof returned by secretariat
Nov 1, 2024