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prEN IEC 60749-22-1

Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods prEN IEC 60749-22-1

General information

10.99 New project approved   Nov 11, 2024

CENELEC

CLC/TC 47X

European Norm

31.080.01   Semiconductor devices in general

Life cycle

NOW

IN_DEVELOPMENT
prEN IEC 60749-22-1
10.99 New project approved
Nov 11, 2024