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prEN IEC 60749-22-1:2024

Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods prEN IEC 60749-22-1:2024

Publication date:   Dec 13, 2024

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40.20 DIS ballot initiated: 12 weeks   Dec 13, 2024

CENELEC

CLC/TC 47X

European Norm

31.080.01   Semiconductor devices in general

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prEN IEC 60749-22-1:2024
40.20 DIS ballot initiated: 12 weeks
Dec 13, 2024