IEC 63546-1 ED1

Required Specification Of Package Substrates For Advanced Semiconductor Packaging - Part 1: Current-Induced Quality Test Method for Package Substrate

Current stage: 20.99 WD approved for registration as CD Jun 21, 2024

Next stage: CD Next stage date : Dec 31, 2024

Originator: IEC

Type: International Standard

ICS: 31.080.01 Semiconductor devices in general

IN_DEVELOPMENT
IEC 63546-1 ED1
20.99 WD approved for registration as CD
Jun 21, 2024