ISO/TS 10303-1754:2006

Industrial automation systems and integration — Product data representation and exchange — Part 1754: Application module: Via component

Publication date:   Dec 12, 2006

95.99 Withdrawal of Standard   May 18, 2010

General information

95.99 Withdrawal of Standard   May 18, 2010

ISO

ISO/TC 184/SC 4 Industrial data

Technical Specification

25.040.40   Industrial process measurement and control

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Scope


ISO/TS 10303-1754:2006 specifies the application module for
Via component.



The following are within the scope of
ISO/TS 10303-1754:2006:



blind vias, connections between multiple layers of the printed circuit assembly where only one end is exposed;
cylinder vias, where the cross-section shape is constant;
tapered vias, where the cross-section shape may vary as the vertical distance changes;
stacked vias, where multiple bind and buried vias share the same x y position;
filled vias, where material may be inserted into the via during realization processes, which are
within the scope of application module Layered interconnect module design, ISO/TS 10303-1698;

buried vias, connections between multiple layers of the printed circuit assembly where neither end is exposed;
interfacial connections, also known as through hole vias, which have both ends exposed;
items within the scope of application module Interconnect module connection routing, ISO/TS 10303-1684;
items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.

Life cycle

NOW

WITHDRAWN
ISO/TS 10303-1754:2006
95.99 Withdrawal of Standard
May 18, 2010

REVISED BY

PUBLISHED
ISO/TS 10303-1754:2010