ISO/TS 10303-1754:2010

Industrial automation systems and integration — Product data representation and exchange — Part 1754: Application module: Via component ISO/TS 10303-1754:2010

Scope

ISO/TS 10303-1754:2010-03 specifies the application module for
Via component.



The following are within the scope of
ISO/TS 10303-1754:2010-03:



blind vias, connections between multiple layers of the printed circuit assembly where only one end is exposed;
cylinder vias, where the cross-section shape is constant;
tapered vias, where the cross-section shape may vary as the vertical distance changes;
stacked vias, where multiple bind and buried vias share the same x y position;
filled vias, where material may be inserted into the via during realization processes, which are
within the scope of application module Layered interconnect module design, ISO/TS 10303-1698;

buried vias, connections between multiple layers of the printed circuit assembly where neither end is exposed;
interfacial connections, also known as through hole vias, which have both ends exposed;
items within the scope of application module Interconnect module connection routing, ISO/TS 10303-1684;
items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.