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ISO 9453:1990

Soft solder alloys — Chemical compositions and forms ISO 9453:1990

Publication date:   Nov 15, 1990

95.99 Withdrawal of Standard   Sep 22, 2006

General information

95.99 Withdrawal of Standard   Sep 22, 2006

ISO

ISO/TC 44/SC 12 Soldering materials

International Standard

25.160.50   Brazing and soldering

Buying

Withdrawn

Language in which you want to receive the document.

Scope

Specifies the requirements for chemical composition for the following soft solder alloys: tin-lead, with and without antimony; tin-silver, with and without lead; tin-copper, with and without lead; tin-antimony; tin-lead-bismuth; bismuth-tin; tin-lead-cadmium; tin-indium; lead-silver, with and without tin.

Life cycle

NOW

WITHDRAWN
ISO 9453:1990
95.99 Withdrawal of Standard
Sep 22, 2006

REVISED BY

ABANDON
ISO/NP 9453

WITHDRAWN
ISO 9453:2006