ISO 9453:2006

Soft solder alloys — Chemical compositions and forms ISO 9453:2006

Publication date:   Sep 22, 2006

Scope

ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:
tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;tin-antimony;tin-bismuth;tin-copper, with and without silver;tin-indium, with and without silver and bismuth;tin-silver, with and without copper and bismuth;tin-zinc, with and without bismuth.
ISO 9453:2006 also includes an indication of the forms generally available.