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IEC PAS 62169:2000 ED1

Standard for handling, packing, shipping and use of moisture/reflow sensitive surface mount devices IEC PAS 62169:2000 ED1

Publication date:   Aug 22, 2000

General information

99.60 Withdrawal effective   Apr 7, 2009

IEC

TC 47

Publicly Available Specification

31.080.01   Semiconductor devices in general

Buying

Replaced

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Scope

Provides SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation.
Applicable to all nonhermetic SMDs subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages and all other packages made with moisture-permeable polymeric materials that are exposed to the ambient air. IEC/PAS 62169 is in the process of being re-issued in the form of IEC international standard under reference IEC 60749-20-1.

Life cycle

NOW

WITHDRAWN
IEC PAS 62169:2000 ED1
99.60 Withdrawal effective
Apr 7, 2009

REVISED BY

WITHDRAWN
IEC 60749-20-1:2009 ED1