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IEC PAS 60191-6-19:2008 ED1

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage

Publication date:   Jan 22, 2008

General information

99.60   Withdrawal effective   Feb 25, 2010

IEC

TC 47/SC 47D

Publicly Available Specification

31.080.01   Semiconductor devices in general

Buying

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Scope

This PAS stipulates the package warpage criteria and the package warpage measurement methods at elevated temperature for BGA, FBGA, and FLGA.

Life cycle

NOW

WITHDRAWN
IEC PAS 60191-6-19:2008 ED1
99.60 Withdrawal effective
Feb 25, 2010

REVISED BY

PUBLISHED
IEC 60191-6-19:2010 ED1