60.60 Standard published Feb 25, 2010
IEC
International Standard
31.080.01 Semiconductor devices in general
Published
IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.
WITHDRAWN
IEC PAS 60191-6-19:2008 ED1
PUBLISHED
IEC 60191-6-19:2010 ED1
60.60
Standard published
Feb 25, 2010