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IEC 60191-6-19:2010 ED1

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage IEC 60191-6-19:2010 ED1

Publication date:   Feb 25, 2010

General information

60.60   Standard published   Feb 25, 2010

IEC

TC 47/SC 47D

International Standard

31.080.01   Semiconductor devices in general

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Scope

IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC PAS 60191-6-19:2008 ED1

NOW

PUBLISHED
IEC 60191-6-19:2010 ED1
60.60 Standard published
Feb 25, 2010




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