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IEC 63215-5 ED1

Endurance test methods for die attach materials – Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices

General information

40.60 Close of voting   Jan 27, 2023

IEC

TC 91

International Standard

31.190   Electronic component assemblies

Life cycle

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IEC 63215-5 ED1
40.60 Close of voting
Jan 27, 2023