IEC 62878-2-603 ED1

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity

Current stage: 50.00 Final text received or FDIS registered for formal approval Nov 1, 2024

Next stage: CFDIS Next stage date : Jan 24, 2025

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180 Printed circuits and boards | 31.190 Electronic component assemblies

IN_DEVELOPMENT
IEC 62878-2-603 ED1
50.00 Final text received or FDIS registered for formal approval
Nov 1, 2024