IEC 62137:2004/COR1:2005 ED1

Corrigendum 1 - Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Current stage: 99.60 Withdrawal effective Oct 9, 2014

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.190 Electronic component assemblies

WITHDRAWN
IEC 62137:2004/COR1:2005 ED1
99.60 Withdrawal effective
Oct 9, 2014