Menu

0

IEC 62137-1-1:2007 ED1

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

Publication date:   Jul 11, 2007

General information

60.60 Standard published   Jul 11, 2007

IEC

TC 91

International Standard

31.190   Electronic component assemblies

Buying

  Published

PDF - €96.80

  English   French  



Buy

Scope

The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.

Life cycle

NOW

PUBLISHED
IEC 62137-1-1:2007 ED1
60.60 Standard published
Jul 11, 2007