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IEC 62047-27:2017 ED1

Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT) IEC 62047-27:2017 ED1

Publication date:   Jan 20, 2017

General information

60.60 Standard published   Jan 20, 2017

IEC

TC 47/SC 47F

International Standard

31.080.99   Other semiconductor devices

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IEC 62047-27:2017(E) specifies a method for assessing the bond strength of glass frit bonded structures using micro-chevron-tests (MCT). It describes suitable sample geometry and provides guidance for the design of deviating sample geometries.
The micro-chevron-test is an experimental method to determine the fracture toughness KIC of brittle materials or bond interfaces using specifically designed test chips (micro-chevron-samples) under defined load conditions (crack opening mode I). Owing to its high precision and low variance, it is suitable for analysing the influence of different process parameters on bond strength as well as for quality assurance.

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PUBLISHED
IEC 62047-27:2017 ED1
60.60 Standard published
Jan 20, 2017