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IEC 62047-25:2016 ED1

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

Publication date:   Aug 29, 2016

General information

60.60 Standard published   Aug 29, 2016

IEC

TC 47/SC 47F

International Standard

31.080.99   Other semiconductor devices

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Scope

IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.

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PUBLISHED
IEC 62047-25:2016 ED1
60.60 Standard published
Aug 29, 2016