IEC 62047-17:2015 ED1

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

Publication date:   Mar 5, 2015

General information

60.60 Standard published   Mar 5, 2015

IEC

TC 47/SC 47F

International Standard

31.080.99   Other semiconductor devices

Buying

  Published

PDF - €229.90

  English   French  



Buy

Scope

IEC 62047-17:2015 specifies the method for performing bulge tests on the free-standing film that is bulged within a window. The specimen is fabricated with micro/nano structural film materials, including metal, ceramic and polymer films, for MEMS, micromachines and others. The thickness of the film is in the range of 0,1 μ to 10 μ, and the width of the rectangular and square membrane window and the diameter of the circular membrane range from 0,5 mm to 4 mm. The tests are carried out at ambient temperature, by applying a uniformly-distributed pressure to the testing film specimen with bulging window. Elastic modulus and residual stress for the film materials can be determined with this method.

Life cycle

NOW

PUBLISHED
IEC 62047-17:2015 ED1
60.60 Standard published
Mar 5, 2015