IEC 61760-4:2015 ED1

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

Publication date:   May 19, 2015

General information

60.60 Standard published   May 19, 2015

IEC

TC 91

International Standard

31.190   Electronic component assemblies

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Scope

IEC 61760-4:2015 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. It also extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices and devices for flow (wave) soldering.

Life cycle

NOW

PUBLISHED
IEC 61760-4:2015 ED1
60.60 Standard published
May 19, 2015

CORRIGENDA / AMENDMENTS

PUBLISHED
IEC 61760-4:2015/AMD1:2018 ED1

REVISED BY

IN_DEVELOPMENT
IEC 61760-4 ED2