IEC 61191-1:2013 ED2

Name: IEC 61191-1:2013 ED2
Brand: IEC
SKU: IEC 61191-1:2013 ED2
Price: 326.7 EUR
Availability: InStock
Rating: 4 (99 reviews)

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Publication date: May 21, 2013

General information

Current stage: 99.60 Withdrawal effective Sep 14, 2018

Next stage: WPUB

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.190 Electronic component assemblies | 31.240 Mechanical structures for electronic equipment

Buying

Status: Revised

PDF - €326.70

Languages: English French

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Scope

IEC 61191-1:2013 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. It also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition:
- reference standard IEC 61192-1 has been replaced by IPC-A-610;
- some of the terminology has been updated;
- references to IEC standards have been corrected;
- the use of lead-free alloys in the assembly have been added.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 61191-1:1998 ED1

NOW

WITHDRAWN
IEC 61191-1:2013 ED2
99.60 Withdrawal effective
Sep 14, 2018

REVISED BY

PUBLISHED
IEC 61191-1:2018 ED3