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IEC 61190-1-3:2017 ED3

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Publication date:   Dec 13, 2017

General information

60.60 Standard published   Dec 13, 2017

IEC

TC 91

International Standard

31.190   Electronic component assemblies

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Scope

IEC 61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.
This edition includes the following significant technical changes with respect to the previous edition:
a) The maximum impurity level of Pb has been revised and the table of lead free solder alloys includes some additional lead free solder alloys.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 61190-1-3:2007 ED2

WITHDRAWN
IEC 61190-1-3:2007/AMD1:2010 ED2

NOW

PUBLISHED
IEC 61190-1-3:2017 ED3
60.60 Standard published
Dec 13, 2017

REVISED BY

IN_DEVELOPMENT
IEC 61190-1-3 ED4