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IEC 61190-1-3:2007 ED2

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Publication date:   Nov 10, 2010

General information

99.60 Withdrawal effective   Dec 13, 2017

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IEC

TC 91

International Standard

31.190   Electronic component assemblies

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Scope

IEC 61190-1-3:2007 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an amendment to Table B.1 concerning lead-free solder alloys.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 61190-1-3:2002 ED1

NOW

WITHDRAWN
IEC 61190-1-3:2007 ED2
99.60 Withdrawal effective
Dec 13, 2017

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 61190-1-3:2007/AMD1:2010 ED2

REVISED BY

PUBLISHED
IEC 61190-1-3:2017 ED3