IEC 61190-1-3:2002 ED1

Name: IEC 61190-1-3:2002 ED1
Brand: IEC
SKU: IEC 61190-1-3:2002 ED1
Price: 284.35 EUR
Availability: InStock
Rating: 4 (70 reviews)

Attachment materials for electronic assembly - Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Publication date: Mar 22, 2002

General information

Current stage: 99.60 Withdrawal effective Apr 26, 2007

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.190 Electronic component assemblies

Buying

Status: Revised

PDF - €284.35

Languages: English French

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Scope

Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications as well as for special electronic grade solders. This standard is a quality control document (not intended to relate directly to the material performance in the manufacturing process).

Life cycle

NOW

WITHDRAWN
IEC 61190-1-3:2002 ED1
99.60 Withdrawal effective
Apr 26, 2007

REVISED BY

WITHDRAWN
IEC 61190-1-3:2007 ED2