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IEC 61189-5-501:2021 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes IEC 61189-5-501:2021 ED1

Publication date:   Jan 26, 2021

General information

60.60   Standard published   Jan 26, 2021

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Scope

IEC 61189-5-501:2021 is used to quantify the deleterious effects of flux residues on surface insulation resistance (SIR) in the presence of moisture.

Life cycle

NOW

PUBLISHED
IEC 61189-5-501:2021 ED1
60.60 Standard published
Jan 26, 2021

REVISED BY

IN_DEVELOPMENT
IEC 61189-5-501 ED2




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