0

IEC 61189-5:2006 ED1

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies IEC 61189-5:2006 ED1

Publication date:   Aug 29, 2006

95.99   Withdrawal of Standard   Apr 2, 2024

General information

95.99   Withdrawal of Standard   Apr 2, 2024

IEC

TC 91

International Standard

31.180   Printed circuits and boards

Buying

Withdrawn

Language in which you want to receive the document.

Scope

IEC 61189-5:2006 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.

Life cycle

NOW

WITHDRAWN
IEC 61189-5:2006 ED1
95.99 Withdrawal of Standard
Apr 2, 2024

REVISED BY

PUBLISHED
IEC 61189-5-501:2021 ED1

PUBLISHED
IEC 61189-5-502:2021 ED1




Access Genorma App Everywhere

Get fast and easy access to top European and International standards (EN, ISO, IEC) via your mobile phone, tablet or the web.

Google Play App Store Web Version