IEC 61189-5:2006 ED1
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
Publication date:
Aug 29, 2006
95.99
Withdrawal of Standard
Apr 2, 2024
General information
95.99
Withdrawal of Standard
Apr 2, 2024
IEC
TC 91
International Standard
31.180
Printed circuits and boards
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Scope
IEC 61189-5:2006 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.
Life cycle
NOW
WITHDRAWN
IEC 61189-5:2006 ED1
95.99
Withdrawal of Standard
Apr 2, 2024