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IEC 61189-3:1997 ED1

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Publication date:   Apr 10, 1997

General information

99.60   Withdrawal effective   Oct 9, 2007

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Scope

Provides a catalogue of test methods representing methodologies and
procedures that can be applied to test materials used for
manufacturing interconnection structures (printed boards) and
assemblies. It mainly covers chemical, mechanical and electrical
test methods.

Life cycle

NOW

WITHDRAWN
IEC 61189-3:1997 ED1
99.60 Withdrawal effective
Oct 9, 2007

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 61189-3:1997/AMD1:1999 ED1

ABANDON
IEC 61189-3/AMD2 ED1

REVISED BY

PUBLISHED
IEC 61189-3:2007 ED2