Revised
Provides a catalogue of test methods representing methodologies and
procedures that can be applied to test materials used for
manufacturing interconnection structures (printed boards) and
assemblies. It mainly covers chemical, mechanical and electrical
test methods.
WITHDRAWN
IEC 61189-3:1997 ED1
99.60
Withdrawal effective
Oct 9, 2007
PUBLISHED
IEC 61189-3:2007 ED2