IEC 61189-3:1997/AMD1:1999 ED1

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) IEC 61189-3:1997/AMD1:1999 ED1

Publication date:   Jul 29, 1999

General information

99.60 Withdrawal effective   Oct 9, 2007

IEC

TC 91

International Standard

31.180   Printed circuits and boards

Buying

Revised

Language in which you want to receive the document.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 61189-3:1997 ED1

NOW

WITHDRAWN
IEC 61189-3:1997/AMD1:1999 ED1
99.60 Withdrawal effective
Oct 9, 2007

REVISED BY

PUBLISHED
IEC 61189-3:2007 ED2