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IEC 61189-2:2006 ED2

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Publication date:   May 30, 2006

General information

60.60   Standard published   May 30, 2006

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Scope

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 61189-2:1997 ED1

WITHDRAWN
IEC 61189-2:1997/AMD1:2000 ED1

ABANDON
IEC 61189-2/AMD2 ED1

NOW

PUBLISHED
IEC 61189-2:2006 ED2
60.60 Standard published
May 30, 2006