0

IEC 61189-2:2006 ED2

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures IEC 61189-2:2006 ED2

Publication date:   May 30, 2006

General information

60.60 Standard published   May 30, 2006

IEC

TC 91

International Standard

31.180   Printed circuits and boards

Buying

Published

Language in which you want to receive the document.

Scope

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 61189-2:1997 ED1

WITHDRAWN
IEC 61189-2:1997/AMD1:2000 ED1

ABANDON
IEC 61189-2/AMD2 ED1

NOW

PUBLISHED
IEC 61189-2:2006 ED2
60.60 Standard published
May 30, 2006