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IEC 61189-2:1997/AMD1:2000 ED1

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures IEC 61189-2:1997/AMD1:2000 ED1

Publication date:   Jan 21, 2000

General information

99.60   Withdrawal effective   May 30, 2006

IEC

TC 91

International Standard

31.180   Printed circuits and boards

Buying

Revised

Language in which you want to receive the document.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 61189-2:1997 ED1

NOW

WITHDRAWN
IEC 61189-2:1997/AMD1:2000 ED1
99.60 Withdrawal effective
May 30, 2006

REVISED BY

PUBLISHED
IEC 61189-2:2006 ED2




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