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IEC 61189-2:1997/AMD1:2000 ED1

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Publication date:   Jan 21, 2000

General information

99.60   Withdrawal effective   May 30, 2006

IEC

TC 91

International Standard

31.180   Printed circuits and boards

Buying

  Revised

PDF - €314.60

  English  



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Life cycle

PREVIOUSLY

WITHDRAWN
IEC 61189-2:1997 ED1

NOW

WITHDRAWN
IEC 61189-2:1997/AMD1:2000 ED1
99.60 Withdrawal effective
May 30, 2006

REVISED BY

PUBLISHED
IEC 61189-2:2006 ED2