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IEC 61188-6-1:2021 ED1

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards IEC 61188-6-1:2021 ED1

Publication date:   Feb 23, 2021

General information

60.60   Standard published   Feb 23, 2021

IEC

TC 91

International Standard

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

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Scope

IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 61188-5-1:2002 ED1

NOW

PUBLISHED
IEC 61188-6-1:2021 ED1
60.60 Standard published
Feb 23, 2021




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