This part of IEC 61163 describes particular methods to apply and optimize reliability stress screening processes for lots of repairable hardware assemblies, in cases where the assemblies have an unacceptably low reliability in the early failure period, and when other methods, such as reliability growth programmes and quality control techniques, are not applicable.
WITHDRAWN
IEC 60300-3-7:1999 ED1
WITHDRAWN
IEC 61163-1:1995 ED1
WITHDRAWN
IEC 61163-1:1995/COR1:1999 ED1
PUBLISHED
IEC 61163-1:2006 ED2
60.60
Standard published
Jun 26, 2006