Aims at testing and determining the effect on all semiconductor electronic devices of storage at elevated temperature without electrical stress applied. This test is considered non-destructive.
The contents of the corrigendum of August 2003 have been included in this copy.
WITHDRAWN
IEC PAS 62205:2000 ED1
WITHDRAWN
IEC 60749:1996 ED2
WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2
WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2
WITHDRAWN
IEC 60749-6:2002 ED1
99.60
Withdrawal effective
Mar 3, 2017
WITHDRAWN
IEC 60749-6:2002/COR1:2003 ED1
PUBLISHED
IEC 60749-6:2017 ED2