Published
Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device. The contents of the corrigendum of August 2003 have been included in this copy.
WITHDRAWN
IEC 60749:1996 ED2
WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2
WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2
PUBLISHED
IEC 60749-32:2002 ED1
60.60
Standard published
Aug 30, 2002
PUBLISHED
IEC 60749-32:2002/COR1:2003 ED1
PUBLISHED
IEC 60749-32:2002/AMD1:2010 ED1