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IEC 60749-25:2003 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

Publication date:   Jul 11, 2003

General information

60.60 Standard published   Jul 11, 2003

IEC

TC 47

International Standard

31.080.01   Semiconductor devices in general

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Scope

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC PAS 62178:2000 ED1

WITHDRAWN
IEC 60749:1996 ED2

WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2

WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2

NOW

PUBLISHED
IEC 60749-25:2003 ED1
60.60 Standard published
Jul 11, 2003