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IEC 60749-20:2020 ED3

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat IEC 60749-20:2020 ED3

Publication date:   Aug 31, 2020

General information

60.60 Standard published   Aug 31, 2020

IEC

TC 47

International Standard

31.080.01   Semiconductor devices in general

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Scope

IEC 60749-20:2020 is available as IEC 60749-20:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition:
- incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition );
- inclusion of new Clause 3;
- inclusion of explanatory notes.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749-20:2008 ED2

NOW

PUBLISHED
IEC 60749-20:2020 ED3
60.60 Standard published
Aug 31, 2020