IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include:
- editorial change in the scope;
- addition of lead-free solder chemical composition specification.
WITHDRAWN
IEC 60749-15:2003 ED1
WITHDRAWN
IEC 60749-15:2010 ED2
99.60
Withdrawal effective
Jul 14, 2020
PUBLISHED
IEC 60749-15:2020 ED3