Menu

0

IEC 60249-2-13:1987 ED1

Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade

Publication date:   Sep 30, 1987

95.99 Withdrawal of Standard   Oct 15, 2004

General information

95.99 Withdrawal of Standard   Oct 15, 2004

IEC

TC 91

International Standard

31.180   Printed circuits and boards

Buying

  Replaced

PDF - €48.40

  English   French   Spanish  



Buy

Scope

Gives requirements for properties of flexible copper-clad polyimide film, general purpose grade including optional requirements which apply only by agreement between purchaser and supplier.
The material consists of an insulating flexible film base with copper foil bonded to one or both sides, with or without the use of an adhesive.

Life cycle

NOW

WITHDRAWN
IEC 60249-2-13:1987 ED1
95.99 Withdrawal of Standard
Oct 15, 2004

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60249-2-13:1987/AMD1:1993 ED1

REVISED BY

PUBLISHED
IEC 61249-2-13:1999 ED1