IEC 60249-2-13:1987/AMD1:1993 ED1

Amendment 1 - Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade IEC 60249-2-13:1987/AMD1:1993 ED1

Publication date:   May 18, 1993

95.99 Withdrawal of Standard   Oct 15, 2004

General information

95.99 Withdrawal of Standard   Oct 15, 2004

IEC

TC 91

International Standard

31.180   Printed circuits and boards

Buying

Replaced

Language in which you want to receive the document.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60249-2-13:1987 ED1

NOW

WITHDRAWN
IEC 60249-2-13:1987/AMD1:1993 ED1
95.99 Withdrawal of Standard
Oct 15, 2004

REVISED BY

PUBLISHED
IEC 61249-2-13:1999 ED1