60.60 Standard published Dec 11, 2001
IEC
International Standard
31.080.01 Semiconductor devices in general
Published
IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).
PUBLISHED
IEC 60191-6-2:2001 ED1
60.60
Standard published
Dec 11, 2001
PUBLISHED
IEC 60191-6-2:2001/COR1:2002 ED1