0

IEC 60191-6-17:2011 ED1

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) IEC 60191-6-17:2011 ED1

Publication date:   Jan 27, 2011

General information

60.60 Standard published   Jan 27, 2011

IEC

TC 47/SC 47D

International Standard

31.080.01   Semiconductor devices in general

Buying

Published

Language in which you want to receive the document.

Scope

IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.

Life cycle

NOW

PUBLISHED
IEC 60191-6-17:2011 ED1
60.60 Standard published
Jan 27, 2011